SIM8950X

PRODUCT CENTER

SIM8950X

智能模组

SIMCom presents an ultra compact and reliable wireless module SIM8950 which is based on Qualcomm MSM8953 multiple-mode LTE platform. SIM8950 is a complete multi-band LTE-FDD/TDD/TD-SCDMA/DC-HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.

List price： 0.00

Price： 0.00

智能模组

SIMCom presents an ultra compact and reliable wireless module SIM8950 which is based on Qualcomm MSM8953 multiple-mode LTE platform. SIM8950 is a complete multi-band LTE-FDD/TDD/TD-SCDMA/DC-HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.

产品详情

General features

SIM8950

•Quad-Band LTE-FDD B1/B3/B5/B8

•Five-Band LTE-TDD B34/B38/B39/B40/B41

•Dual-Band UMTS/HSDPA/HSPA+ B1/B8

•Dual-Band TD-SCDMA B34/B39

•EVDO/CDMA BC0

•Dual-Band GSM/GPRS/EDGE B3/B8

SIM8950E

• Five-Band LTE-FDD B1/3/5/7/8/20

• Third-Band LTE-TDD B38/B40/B41

• Quad-Band UMTS/HSDPA/HSPA+ B1/B2/B5/B8

• Quad-Band GSM/GPRS/EDGE B2/B3/B5/B8

•GPRS multi-slot class 12

•EDGE multi-slot class 12

•WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps

•BT2.1+EDR/3.0/4.2 LE

•Supply voltage range: 3.4 ~ 4.4 V

•Operation temperature: : -25℃ to +75℃

•Storage temperature : -40℃ to +90℃

•Dimension: 44.1*45.6*2.8mm

•Weight: 12.5g

•LTE FDD/TDD Rel-9 Cat4/Rel-10 Cat7

•UTMS

•HSPA+ DC-HSPA+,Rel-10

•TD-SCDMA HSDPA Cat. 15-SIM8950

•TD-SCDMA HSUPA Cat. 6-SIM8950

•GSM GSM R99,GPRS,EDGE

•GNSS gpsOne Gen 8C lite; GPS, BeiDou, GLONASS or Galileo;

• WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps-SIM8950E

• BT2.1+EDR/3.0/4.2 LE-SIM8950E

Specifications for Data transfer

•LTE-FDD/LTE-TDD

- Uplink up to 50Mbps,

- Downlink up to 150Mbps

•HSPA+

- Uplink up to 11 Mbps,

- Downlink up to 42 Mbps

•UMTS

- Uplink/Downlink up to 384Kbps

•TD-HSDPA/HSUPA

- Uplink up to 2.2 Mbps,

- Downlink up to 2.8 Mbps

•TD-SCDMA

- Uplink up to 128Kbps,

- Downlink up to 384Kbps

Other features

•2GB LPDDR3 RAM + 16GB eMMC flash

•Octa-core ARM cortex A53 2.0GHz

•Video 4K at 30fps, 1080p at 60 fps Encode (H.264/H.265/VP8) Decode(/H.264/H.265/VP8/VP9)

•GPU Andreno 506 650MHz, 3D graphics accelerator OpenCL2.0 FP, DX12, PenGL ES3.1+, AEP

•Web technologies V8 JavaScript Engine optimizations JPEG hardware decode acceleration IP and HTTP tuning Flash and video processor decode optimization

•Android7.x

Interfaces

•2 Camera (MIPI, 24MP)

•2 LCD (MIPI,FHD 1920X1200 @60fps) Capacitive panels via ext IC

•Analog Audio (Microphone, Headset, Handset)

•USB 2.0/3.0, OTG, type C

•UART

•I2C interface

•ADC 10bit

•Micro SD card interface

•Battery

•GPIO