SIMCom presents an ultra compact and reliable wireless module SIM8950L which is based on
Qualcomm SDM450 multiple-mode LTE platform. SIM8950L is a complete multi-band LTEFDD/TDD/TD-SCDMA/DC HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.
SIMCom presents an ultra compact and reliable wireless module SIM8950L which is based on
Qualcomm SDM450 multiple-mode LTE platform. SIM8950L is a complete multi-band LTEFDD/TDD/TD-SCDMA/DC HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.
General features
Quad-Band LTE-FDD B1/B3/B5/B8 • Five-Band LTE-TDD B34/B38/B39/B40/B41 • Dual-Band UMTS/HSDPA/HSPA+ B1/B8 • Dual-Band TD-SCDMA B34/B39 • EVDO/CDMA BC0 • Dual-Band GSM/GPRS/EDGE B3/B8 • GPRS multi-slot class 12 • EDGE multi-slot class 12 • WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps • BT2.1+EDR/3.0/4.2 LE • Supply voltage range: 3.4 ~ 4.4 V • Operation temperature: : -25℃ to +75℃ • Storage temperature : -40℃ to +90℃ • Dimension: 44.1*45.6*2.8mm • Weight: 12.5g • LTE FDD/TDD Rel-9 Cat4/Rel-10 Cat7 • UTMS • HSPA+ DC-HSPA+,Rel-10 • TD-SCDMA HSDPA Cat. 15 • TD-SCDMA HSUPA Cat. 6 • GSM GSM R99,GPRS,EDGE • GNSS gpsOne Gen 8C lite; GPS, BeiDou, GLONASS or Galileo; | Specifications for Data transfer • LTE-FDD/LTE-TDD - Uplink up to 50Mbps, - Downlink up to 150Mbps • HSPA+ - Uplink up to 11 Mbps, - Downlink up to 42 Mbps • UMTS - Uplink/Downlink up to 384Kbps • TD-HSDPA/HSUPA - Uplink up to 2.2 Mbps, - Downlink up to 2.8 Mbps • TD-SCDMA - Uplink up to 128Kbps, - Downlink up to 384Kbps | Other features •1GB LPDDR3 RAM + 8GB eMMC flash •Octa-core ARM cortex A53 1.8GHz • 1080p at 60 fps Encode (H.264/H.265/VP8) Decode(/H.264/H.265/VP8/VP9) •GPU Andreno 506 650MHz, 3D graphics accelerator OpenCL2.0 FP, DX12, PenGL ES3.1+, AEP •Web technologies V8 JavaScript Engine optimizations JPEG hardware decode acceleration IP and HTTP tuning Flash and video processor decode optimization •Android7.x/8.x Interfaces • 2 Camera (MIPI, 21MP) • 2 LCD (MIPI,FHD 1920X1200 @60fps) Capacitive panels via ext IC •Analog Audio (Microphone, Headset, Handset) • USB 2.0/3.0, OTG, type C • UART • I2C interface • ADC 10bit • Micro SD card interface • Battery • GPIO • SPI • RTC Certifications • ROHS(TBD) |