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SIM8950L

SIMCom presents an ultra compact and reliable wireless module SIM8950L which is based on

Qualcomm SDM450 multiple-mode LTE platform. SIM8950L is a complete multi-band LTEFDD/TDD/TD-SCDMA/DC HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.


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SIMCom presents an ultra compact and reliable wireless module SIM8950L which is based on

Qualcomm SDM450 multiple-mode LTE platform. SIM8950L is a complete multi-band LTEFDD/TDD/TD-SCDMA/DC HSPA+/HSPA/UMTS/EVDO/EGDE/GPRS/GSM/GNSS smart module designed with very powerful processors, allowing customers to benefit from small dimensions and cost-effective product solutions with low power consumption in high-speed throughput.


产品详情
General features
 Quad-Band LTE-FDD B1/B3/B5/B8
• Five-Band LTE-TDD B34/B38/B39/B40/B41
• Dual-Band UMTS/HSDPA/HSPA+ B1/B8
• Dual-Band TD-SCDMA B34/B39
• EVDO/CDMA BC0
• Dual-Band GSM/GPRS/EDGE B3/B8
• GPRS multi-slot class 12
• EDGE multi-slot class 12
• WIFI 2.4/5G 802.11a/b/g/n/ac up to 433Mbps
• BT2.1+EDR/3.0/4.2 LE
• Supply voltage range: 3.4 ~ 4.4 V
• Operation temperature: : -25℃ to +75℃
• Storage temperature : -40℃ to +90℃
• Dimension: 44.1*45.6*2.8mm
• Weight: 12.5g
• LTE FDD/TDD Rel-9 Cat4/Rel-10 Cat7
• UTMS
• HSPA+ DC-HSPA+,Rel-10
• TD-SCDMA HSDPA Cat. 15
• TD-SCDMA HSUPA Cat. 6
• GSM GSM R99,GPRS,EDGE
• GNSS gpsOne Gen 8C lite; GPS, BeiDou, GLONASS or Galileo;
 
 
Specifications for Data transfer
• LTE-FDD/LTE-TDD
- Uplink up to 50Mbps,
- Downlink up to 150Mbps
• HSPA+
- Uplink up to 11 Mbps,
- Downlink up to 42 Mbps
• UMTS
- Uplink/Downlink up to 384Kbps
• TD-HSDPA/HSUPA
- Uplink up to 2.2 Mbps,
- Downlink up to 2.8 Mbps
• TD-SCDMA
- Uplink up to 128Kbps,
- Downlink up to 384Kbps
Other features
•1GB LPDDR3 RAM + 8GB eMMC flash
•Octa-core ARM cortex A53 1.8GHz
• 1080p at 60 fps
Encode (H.264/H.265/VP8)
Decode(/H.264/H.265/VP8/VP9)
•GPU
Andreno 506 650MHz, 3D graphics accelerator
OpenCL2.0 FP, DX12, PenGL ES3.1+, AEP
•Web technologies
V8 JavaScript Engine optimizations
JPEG hardware decode acceleration
IP and HTTP tuning
Flash and video processor decode optimization
•Android7.x/8.x
 
Interfaces
• 2 Camera (MIPI, 21MP)
• 2 LCD (MIPI,FHD 1920X1200 @60fps)
Capacitive panels via ext IC
•Analog Audio (Microphone, Headset, Handset)
• USB 2.0/3.0, OTG, type C
• UART
• I2C interface
• ADC 10bit
• Micro SD card interface
• Battery
• GPIO
• SPI
• RTC
 
Certifications 
• ROHS(TBD)
Contact us
Online booking